Indiana Secures Investment Agreement for Advanced Chip Packaging with SK hynix

Indiana Secures Investment Agreement for Advanced Chip Packaging with SK hynix Enterprise

  • To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D
  • Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue
  • Industry’s first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience

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Source: SK Group Newsroom, Link

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