Absolics and U.S. Department of Commerce to Provide $75 Million in Funding for Semiconductor Material Manufacturing Under CHIPS and Science Act Enterprise X Facebook LINE LinkedIn Copy 2024.06.02 Absolics’ glass substrate nears completion in its manufacturing process. The material will reduce the space required for a multi-chip package, allowing for more chips to be packed into a single device. SKC CEO Woncheol Park speaks at an event in May at Absolics’ Covington, Ga., site to highlight proposed funding for Absolics under the CHIPS and Science Act. Source: SK Group Newsroom, Link
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