Absolics and U.S. Department of Commerce to Provide $75 Million in Funding for Semiconductor Material Manufacturing Under CHIPS and Science Act

Absolics and U.S. Department of Commerce to Provide $75 Million in Funding for Semiconductor Material Manufacturing Under CHIPS and Science Act Enterprise

Substrate
Absolics’ glass substrate nears completion in its manufacturing process. The material will reduce the space required for a multi-chip package, allowing for more chips to be packed into a single device.
SKC CEO
SKC CEO Woncheol Park speaks at an event in May at Absolics’ Covington, Ga., site to highlight proposed funding for Absolics under the CHIPS and Science Act.



Source: SK Group Newsroom, Link

Comments

Copied title and URL